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Verify on official websiteInterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and
Tuesday, October 28, 2025 - Thursday, October 30, 2025
Anaheim, USA
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and
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Request a DemoOr start free trial →InterPACK® Conference & Exhibition takes place on Tuesday, October 28, 2025 to Thursday, October 30, 2025.
InterPACK® Conference & Exhibition is held in Anaheim, USA at Hotel FERA Anaheim, a DoubleTree by Hilton.
Pricing information is available on the event website.
InterPACK® Conference & Exhibition is designed for technology professionals looking to network, learn, and discover new opportunities.
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